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484 documents

  • Valentin Heyraud. Noise and trainability in quantum machine learning. Mathematical Physics [math-ph]. Université Paris Cité, 2023. English. ⟨NNT : 2023UNIP7237⟩. ⟨tel-04702049⟩
  • Othmane Meskine, Eloi Descamps, Arne Keller, Aristide Lemaître, Florent Baboux, et al.. Fundamental limitations of time measurement precision in Hong-Ou-Mandel interferometry. 2023. ⟨hal-04243981⟩
  • M. Cavalcante, S. Bag, I. Paul, A. Sacuto, M. Aguiar, et al.. Raman response of the charge density wave in cuprate superconductors. Physical Review B, 2023, 108 (16), pp.165111. ⟨10.1103/PhysRevB.108.165111⟩. ⟨hal-04452167⟩
  • Claudine Crépin, Erwan Paineau-Lanone, Noel Dimarcq, Laurence Ramos, Antoine Ronda, et al.. Rapport de Prospectives du CSI-INP 2019-2023. CoNRS. 2023. ⟨hal-04232515v3⟩
  • Alexandr Alekhin, Alexey Lomonosov, Naëmi Leo, Markus Ludwig, Vladimir Vlasov, et al.. Quantitative Ultrafast Magnetoacoustics at Magnetic Metasurfaces. Nano Letters, 2023, ⟨10.1021/acs.nanolett.3c02336⟩. ⟨hal-04247833⟩
  • Sarah Houver, Sophie Eliet, Pascale Roy, Romain Peretti. La spectroscopie TéraHertz: électrons et vibrations. Photoniques, 2023, pp.40-5. ⟨10.1051/photon/202312140⟩. ⟨hal-04172580⟩
  • Yuncheng Mao. Two-dimensional materials, correlations and topology. Materials Science [cond-mat.mtrl-sci]. Université Paris Cité, 2023. English. ⟨NNT : 2023UNIP7278⟩. ⟨tel-04738608⟩
  • Abdallah Nassereddine, Laurent Delannoy, Christian Ricolleau, Catherine Louis, Alloyeau D., et al.. Atomic Scale Observation of the Structural Dynamics of Supported Gold Nanocatalysts under 1,3‐Butadiene by in situ Environmental Transmission Electron Microscopy. ChemCatChem, 2023, 15 (15), pp.e202300434. ⟨10.1002/cctc.202300434⟩. ⟨hal-04210993⟩
  • Arjun Bharath Curam, Vianney Mille, Grégory Abadias, Philippe Djemia, Christian Ricolleau, et al.. Synthesis and characterization of CoCrNi and Fex(CoCrNi)1-X high entropy alloy thin films with unique atomic structures and enhanced mechanical properties. École d'été - Cargèse IESC - École HEA Métallurgie, Sep 2023, Cargèse, France. . ⟨hal-04308840⟩
  • Peng Zhao, Hong Yu Li, Jean-Pierre Likforman, Theo Henner, Yu Dian Lim, et al.. Simplified Assembly of Through-Silicon-Via Integrated Ion Traps. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023, 13 (9), pp.1337-1343. ⟨10.1109/TCPMT.2023.3309831⟩. ⟨hal-04307922⟩

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